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Enhanced, Compact and Ultra-Compact Heat Exchangers: Science, Engineering and Technology
September 11-16, 2005 - Whistler, British Columbia, Canada
| Editors: |
Ramesh K. Shah, Subros Ltd, Noida, UP, India
Masaru Ishizuka, Toyama Prefectural University, Toyama, Japan
Thomas M. Rudy, ExxonMobil Research & Engineering Co., Fairfax, VA, USA
Vishwas V. Wadekar, HTFS, Hyprotech UK Ltd, Harwell, Oxfordshire, UK |
The articles for these proceedings are not peer-reviewed.
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Embedded Solid-State Cooling Layer Configurations in Power Electronics
J. Dirker
J.D. van Wyk
J.P. Meyer
J. Dirker, J.D. van Wyk, and J.P. Meyer, "Embedded Solid-State Cooling Layer Configurations in Power Electronics" in "Enhanced, Compact and Ultra-Compact Heat Exchangers: Science, Engineering and Technology", Ramesh K. Shah, Subros Ltd, Noida, UP, India
Masaru Ishizuka, Toyama Prefectural University, Toyama, Japan
Thomas M. Rudy, ExxonMobil Research & Engineering Co., Fairfax, VA, USA
Vishwas V. Wadekar, HTFS, Hyprotech UK Ltd, Harwell, Oxfordshire, UK
Eds, ECI
Symposium Series, Volume P6 (2005). http://services.bepress.com/eci/heatexchangerfall2005/47
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